What are the development trends of the DC power supply module market?

To meet the increasing market demands for power supply performance, the DC module power supply is evolving towards high efficiency, high power density, low voltage and high current, low noise, good dynamic characteristics, and wide input ranges. The trend of miniaturization, modularization, and standardization, along with the use of building block-style circuit topologies, is becoming increasingly prevalent. Below is a focused analysis of these key trends.

High Power Density and Efficiency

Modern communication products require smaller sizes, necessitating a reduction in volume and an increase in power density for module power supplies. New conversion and packaging technologies have enabled power densities to reach 188 W/in³, more than doubling that of traditional power supplies, with efficiencies exceeding 90%. This achievement is largely due to advancements in microelectronics that have introduced a variety of high-performance devices, significantly reducing losses. A notable example is the use of high-performance Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) in synchronous rectifiers, which have reduced voltage drops from 0.4V to 0.2V. Manufacturers are developing MOSFETs with decreasing on-resistance, dropping from 180 mΩ to 18 mΩ, while integrated silicon wafer technology has reduced component counts by over two-thirds, minimizing stray inductance and wiring resistance compared to discrete components.

Low Voltage and High Current

As microprocessor operating voltages decrease, module power supply output voltages have fallen from 5V to 3.3V and even 1.8V, with predictions suggesting further reductions below 1.0V. Concurrently, the required currents for integrated circuits are increasing, demanding higher load output capabilities from power supplies. For instance, a 1V/100A module power supply would require an effective load equivalent to 0.01Ω; traditional technologies struggle to meet such demanding design requirements. In scenarios with a 10 mΩ load, every milliohm of resistance in the path to the load can decrease efficiency by 10%. Factors such as PCB trace resistance, inductor series resistance, and MOSFET conduction resistance all impact efficiency. Companies like Nanjing Pengtu Power have integrated critical power semiconductors and passive components into a cohesive basic module design that reduces path resistance to the load, thereby minimizing power loss and size. The adoption of multi-phase design techniques using these basic modules is also on the rise; this approach allows for smaller MOSFETs and inductors due to reduced phase output currents.

Utilizing Software for Power Supply Design

The variety of DC voltage types in communication systems continues to grow, while increasing power density and integration levels complicate design processes. Traditional manual design methods can no longer keep pace with rapidly changing market demands; thus, power supply auxiliary design software has emerged. These tools assist in component selection and provide material lists, circuit simulations, and thermal analyses, shortening design cycles and enhancing performance. The software allows for customization across various parameters such as input/output voltage ranges and maximum output currents while guiding designers through component selection. It includes comprehensive transformer designs using multiple topological methods to optimize circuits based on cost or efficiency.

Market Outlook

The global market for DC power supply modules is projected to experience robust growth driven by factors such as the increasing demand for consumer electronics and electric vehicles (EVs). The market size is expected to grow from USD 487.6 million in 2024 to USD 764.6 million by 2034 at a CAGR of approximately 4.6%

The rise of smart home technologies and IoT devices further fuels this demand as they require efficient power solutions.In summary, the DC module power supply market is evolving rapidly with trends focused on efficiency improvements, size reduction through advanced materials and designs, and enhanced design processes facilitated by software tools. This evolution is crucial for meeting the growing demands of modern electronic applications across various sectors.